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Qianli iBlack 3D BGA Reballing Stencil Kit for Android Qualcomm EMMC DDR MTK
Qianli iBlack 3D BGA Reballing Stencil Kit for Android Qualcomm EMMC DDR MTK
Qianli iBlack 3D BGA Reballing Stencil Kit for Android Qualcomm EMMC DDR MTK
Qianli iBlack 3D BGA Reballing Stencil Kit for Android Qualcomm EMMC DDR MTK
Qianli iBlack 3D BGA Reballing Stencil Kit for Android Qualcomm EMMC DDR MTK
Qianli iBlack 3D BGA Reballing Stencil Kit for Android Qualcomm EMMC DDR MTK

Qianli iBlack 3D BGA Reballing Stencil Kit for Android Qualcomm EMMC DDR MTK

$ 8.97

Availability: 28 in stock
  • Return shipping will be paid by: Buyer
  • Thickness: 0.12MM
  • 100%: Brands new
  • Application 2: EMMC BGA MTK MSM SDM
  • DIY Supplies: Electrical
  • MPN: Does Not Apply
  • Item must be returned within: 30 Days
  • Material: Stainless steel
  • is_customized: Yes
  • Brand: None
  • Condition: New
  • Feature: Square hole reballing stencil
  • Application 1: For Android phone repair
  • Model Number: Qianli iBlack Reballing Stencil for Android
  • All returns accepted: Returns Accepted
  • Refund will be given as: Money back or replacement (buyer's choice)

    Description

    Qianli iBlack 3D BGA Reballing Stencil Kit for Android Qualcomm EMMC DDR MTK
    Qianli iBlack 3D BGA Reballing Stencil Kit for Android Qualcomm EMMC DDR MTK 6582 MSM8916 8917 8909 8939 8953 8940 Kirin 665 659 SDM 660
    Brand Name: None DIY Supplies: Electrical is_customized: Yes Model Number: Qianli iBlack Reballing Stencil for Android Material: Stainless steel Thickness: 0.12MM Application 1: For Android phone repair 100%: Brands new Application 2: EMMC BGA MTK MSM SDM Feature: Square hole reballing stencil